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The SSD3K5E series from Silicon Power is a 2.5" SATA3 solid state storage device that utilizes 3D NAND flash memory technology. This series offers various models to cater to different demands:
The SSD3K5E Embedded series features a DRAM-less and power-shielding firmware architecture designed to manage sudden power-loss situations. It is equipped with an advanced LDPC ECC engine that can correct up to 2KB of code word, as well as a Block/Page RAID function to ensure 3K PE cycles endurance with 3D NAND. The SSD3K5E series also incorporates the latest Direct-To-TLC and SLC cache firmware architecture, which helps achieve optimal sustained read/write performance and reduces Write Amplification, offering even better TBW endurance than 2D MLC models.
To extend the SSD's lifespan, the SSD3K5E series employs an early weak block retirement and global wear leveling algorithm, ensuring equal usage of the flash memory cells. Additionally, it features an Industrial-grade circuit design that provides a higher reliability power design compared to traditional discrete circuits. The SSD3K5E series also offers complete protection with OVP, OCP, Surge Rejection, and In-Out Short Protection, providing a higher level of protection than traditional fuse design.
Regarding the RAM, this DIMM is manufactured using raw cards developed for broad industry use as reference designs, minimizing electrical variation between suppliers. The DDR4 SDRAM SODIMM provides a high-performance, flexible 8-byte interface in a space-saving footprint, intended for use in applications operating at 1200MHz or 1333MHz clock speeds and achieving high-speed data transfer rates of 3200Mbps.
Before any access operation, the device's CAS latency and burst/length/operation type must be programmed into the DIMM by address inputs A0-A15(1Gx8) and I/O inputs BA0, BA1, BG0, BG1 using the mode register set cycle. The DIMM utilizes a serial presence-detect implemented via a serial EEPROM using a standard IIC protocol.
The key specifications of the SSD3K5E series include: - Hardware LDPC ECC engine (120bit/1KB) and Block/Page RAID - MTBF: 3,000,000 hrs - Maximum 4K Random Access: Write 82,000 IOPS - TBW Data (estimated): Client: 728 TB/ Enterprise 202 TB - Native Command Queuing up to 32 commands - Operating Temperature: -20 °C to 75 °C
The RAM specifications are: - 16GB (1 x 16GB) Capacity - 16GB (2Gx72) 1Gx8 2Ranks - Enterprise Grade ECC DDR4 3200MTs
product information:
Attribute | Value |
---|---|
brand | SP Silicon Power |
date_first_available | July 12, 2024 |